Title :
Design and First Tests of a Radiation-Hard Pixel Sensor for the European X-Ray Free-Electron Laser
Author :
Schwandt, Joern ; Fretwurst, Eckhart ; Klanner, Robert ; Kopsalis, Ioannis ; Jiaguo Zhang
Author_Institution :
Inst. of Exp. Phys., Hamburg Univ., Hamburg, Germany
Abstract :
The high intensity and high repetition rate of the European X-ray Free-Electron Laser, presently under construction in Hamburg, requires silicon sensors which can stand X-ray doses of up to 1 GGy for 3 years of operation at high bias voltage. Within the AGIPD Collaboration the X-ray-radiation damage in MOS Capacitors and Gate-Controlled Diodes fabricated by four vendors on high-ohmic n-type silicon with two crystal orientations and different technological parameters, has been studied for doses between 1 kGy and 1 GGy. The extracted values of oxide-charge and surface-current densities have been used in TCAD simulations, and the layout and technological parameters of the AGIPD pixel sensor optimized. It is found that the optimized layout for high X-ray doses is significantly different from the one for non-irradiated sensors. First sensors and test structures have been delivered in early 2013. Measurement results for X-ray doses of 0 to 10 MGy and their comparison to simulations are presented. They demonstrate that the optimization has been successful and that the sensors fulfill the required specifications.
Keywords :
MOS capacitors; free electron lasers; silicon radiation detectors; AD 2013; AGIPD Collaboration; European X-ray free-electron laser; MOS capacitors; TCAD simulations; X-ray doses; X-ray-radiation damage; crystal orientations; gate-controlled diodes; high-ohmic n-type silicon; oxide-charge density; radiation-hard pixel sensor; silicon sensors; surface-current density; technological parameters; Conductivity; Implants; Junctions; Optimization; Radiation effects; Semiconductor process modeling; X-ray lasers; AGIPD; European XFEL; X-ray-radiation damage; sensor simulation; silicon-pixel sensor;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2014.2304239