DocumentCode
731761
Title
Long-term evaluation of a non-hermetic micropackage technology for MEMS-based, implantable pressure sensors
Author
Wang, P. ; Majerus, S.J.A. ; Karam, R. ; Hanzlicek, B. ; Lin, D.L. ; Zhu, H. ; Anderson, J.M. ; Damaser, M.S. ; Zorman, C.A. ; Ko, W.H.
Author_Institution
Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
fYear
2015
fDate
21-25 June 2015
Firstpage
484
Lastpage
487
Abstract
This paper reports long-term evaluation of a micropackage technology for an implantable MEMS pressure sensor. The all-polymer micropackage survived > 160 days when subjected to accelerated lifetime testing at 85°C in a 1% wt. saline solution. The package exhibited minimum impact on sensitivity and linearity, which deviated by less than 5% and 0.3%, respectively. A 6-month in vivo evaluation of 16 MEMS-based pressure sensors showed that the micropackage exhibits good biocompatibility and provides excellent protection. To the best of our knowledge, these results establish new lifetime records for devices packaged using an all-polymer micropackaging approach.
Keywords
life testing; microsensors; packaging; pressure sensors; accelerated lifetime testing; all-polymer micropackage; implantable MEMS pressure sensor; long-term evaluation; non-hermetic micropackage technology; temperature 85 degC; Implants; Life estimation; Micromechanical devices; Packaging; Pressure sensors; Sensitivity; Testing; Non-hermetic micropackage; PDMS; Parylene-C; biocompatibility; encapsulation; packaging; pressure sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location
Anchorage, AK
Type
conf
DOI
10.1109/TRANSDUCERS.2015.7180966
Filename
7180966
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