Multilayer ferromagnetic composites enabling on-chip magnetic-core inductors beyond 1 GHZ

Author

Liljeholm, J. ; Ebefors, T. ; Rohrmann, H. ; Shah, U. ; Oberhammer, J.

Author_Institution

Silex Microsyst., Stockholm, Sweden

fYear

2015

fDate

21-25 June 2015

Firstpage

811

Lastpage

814

Abstract

This paper reports of fabricated unpatterned ferromagnetic NiFe/AlN multilayer composites and an established process flow for magnetic core material suitable for integration with Silex 3D RF TSV technology. The fabricated single-loop test inductors achieved an inductance enhancement of 4.8 and a quality factor enhancement of 4.5 at 400 MHz. Simulations show that magnetic material in connection with 3D TSV inductors result in an inductance enhancement up to a factor of 5 at GHz frequencies for the same inductor area or the same inductance can be achieved at 9 times smaller area and cost.

Keywords

III-V semiconductors; aluminium compounds; ferromagnetic materials; inductors; magnetic cores; nickel compounds; radiofrequency integrated circuits; three-dimensional integrated circuits; wide band gap semiconductors; 3D TSV inductors; NiFe-AlN; Silex 3D RF TSV technology; fabricated single-loop test inductors; magnetic core material; multilayer ferromagnetic composite; on-chip magnetic-core inductors; unpatterned ferromagnetic multilayer composites; Inductors; Magnetic multilayers; Magnetomechanical effects; Perpendicular magnetic anisotropy; Radio frequency; Three-dimensional displays; MEMS foundry; NiFe/AlN multilayer composite; RF microstrip; magnetic materials; micro machined inductors;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on

Conference_Location

Anchorage, AK

Type

conf

DOI

10.1109/TRANSDUCERS.2015.7181047

Filename

7181047