Title :
Performance improvement of CMOS-MEMS Pirani vacuum gauge with hollow heater design
Author :
Yi-Chiang Sun ; Kai-Chih Liang ; Chao-Lin Cheng ; Ming-Yie Lin ; Rong-shun Chen ; Weileun Fang
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
A novel heater-with-holes design is developed to realize a CMOS-MEMS Pirani vacuum gauge. The Pirani vacuum gauge is a thermal-based pressure sensor consisting of heater and heat-sink units. The heat is conducted from heater to heat-sink through gas whose thermal conductivity changed with pressure. The proposed design has the following merits: (1) The holes on heater increase the thermal resistance and then improve the efficiency of heat transfer; (2) The heat-sink mesas are added to compensate the lost active area between heater and heat sink; (3) Easily integrate with other packaged CMOS-MEMS devices for pressure monitoring [1]. This study demonstrates two heaters with different hole-designs for concept proven. The devices have total die size of 206μm×82μm and 0.53μm sensing gap. Preliminary results show that the gauges have sensing range of 0.8-200torr and 0.2-200torr with sensitivity of 6.99×103(K/W)/torr and 8.15×103(K/W)/torr. The power dissipations are respectively 179.43μW and 127.59μW. In comparison, the conventional gauge containing heater w/o holes has sensing range 1-200torr with sensitivity of 0.91×103(K/W)/torr and power dissipation of 1117.34μW.
Keywords :
CMOS integrated circuits; heat sinks; integrated circuit design; integrated circuit packaging; microfabrication; microsensors; pressure measurement; pressure sensors; temperature measurement; temperature sensors; thermal conductivity measurement; thermal resistance measurement; vacuum gauges; CMOS-MEMS Pirani vacuum gauge; heat conduction; heat transfer; heat-sink unit; hollow heater-with-hole design; packaging; power 1117.34 muW; power 127.59 muW; power 179.43 muW; power dissipation; pressure 0.2 torr to 200 torr; pressure monitoring; thermal conductivity; thermal resistance; thermal-based pressure sensor; Heat sinks; Heat transfer; Resistance heating; Sensors; Thermal resistance; CMOS-MEMS; Pirani; Thermal resistance; Vacuum;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
DOI :
10.1109/TRANSDUCERS.2015.7181111