• DocumentCode
    73187
  • Title

    Fabrication of Micro-Polymer Lenses With Spacers Using Low-Cost Wafer-Level Glass-Silicon Molds

  • Author

    Shunjin Qin ; Jintang Shang ; Mengying Ma ; Li Zhang ; Chiming Lai ; Qing-An Huang ; Ching-Ping Wong

  • Author_Institution
    Key Lab. of MEMS of the Minist. of Educ., Southeast Univ., Nanjing, China
  • Volume
    3
  • Issue
    12
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    2006
  • Lastpage
    2013
  • Abstract
    A novel low-cost molding process to prepare polymer-based micro-lens arrays with spacers for optical applications was investigated in this paper. The process consists of the following steps: 1) hemispherical glass bubble arrays, used as the upper part of the molds, was prepared by combining a hot-forming process and a chemical-foaming process; 2) the silicon mold, used as the lower part of the molds, was fabricated by etching; 3) an anti-stick layer was coated on the concave surface of the glass mold; and 4) the lens material, UV-curable glue, was dispensed into the concave molds, followed by curing and de-molding. The optical properties of the lens were characterized by a profile meter and a beam analyzer. The results showed that the micro-polymer lens arrays with spacers were successfully prepared using the low-cost wafer-level glass-silicon mold. The results indicate that the micro-lenses have hemispherical structures and smooth surface.
  • Keywords
    curing; moulding; polymers; UV curable glue; antistick layer; beam analyzer; chemical foaming process; concave molds; concave surface; curing; demolding; etching; glass mold; hemispherical glass bubble arrays; hemispherical structures; hot forming process; lens material; low cost molding process; low cost wafer level glass silicon molds; micropolymer lens arrays; micropolymer lenses; optical applications; polymer based microlens arrays; profile meter; smooth surface; spacers; Glass; Lenses; Microoptics; Polymers; Silicon; Surface treatment; Wafer scale integration; Anti-stick treatment; UV molding; chemical-forming process (CFP); glass mold; hot-forming process (HFP); micro-lens arrays (MLAs); self-alignment structure; wafer-level package (WLP);
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2286162
  • Filename
    6650079