DocumentCode :
731902
Title :
A low-cost fabrication technique for direct sewing stretchable interconnetions for wearable electronics
Author :
Rahimi, R. ; Yu, W. ; Parupudi, T. ; Ochoa, M. ; Ziaie, B.
Author_Institution :
Purdue Univ., West Lafayette, IN, USA
fYear :
2015
fDate :
21-25 June 2015
Firstpage :
1350
Lastpage :
1353
Abstract :
Here, we present a facile method for rapid fabrication of low-cost, stretchable electrical interconnections for wearable electronics. Using a commercial sewing machine, thin metallic wires are sewn onto the wearable materials in a double-stitch zigzag pattern, with the second stitch being a water-soluble polyvinyl alcohol (PVA) thread. The stretchable pattern is secured onto a clothing (e.g., a glove) with a stretchable elastomer coating followed by dissolution of the PVA thread in water. The interconnections maintain a constant electrical conductivity for strains up to 50 % and bending cycles over 15000. As a proof of concept implementation, we sewed interconnects and a soft capacitive force sensor onto a latex glove to create a wearable tactile sensor with a linear sensitivity of 96 fF/N.
Keywords :
capacitive sensors; flexible electronics; integrated circuit interconnections; wearable computers; PVA thread; direct sewing stretchable interconnetions; fabrication technique; soft capacitive force sensor; stretchable electrical interconnections; water-soluble polyvinyl alcohol; wearable electronics; wearable tactile sensor; Capacitance; Fabrication; Force; Strain; Tactile sensors; Wires; Stretchable electronic; sewing; tactile; wearable;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
Type :
conf
DOI :
10.1109/TRANSDUCERS.2015.7181182
Filename :
7181182
Link To Document :
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