DocumentCode :
732037
Title :
A Flexible, metallic electrospray emitter with embedded flow homogenizer
Author :
Xiaochen Wang ; Cheng Li ; Weiwei Yang ; Weiwei Deng ; Cho, Hyoung J.
Author_Institution :
Mater. Sci. & Eng, Univ. of Central Florida, Orlando, FL, USA
fYear :
2015
fDate :
21-25 June 2015
Firstpage :
2152
Lastpage :
2155
Abstract :
This work reports a novel design and batch fabrication method of an electrospray emitter suitable for space propulsion. Our device only involves two-step photolithography and electroplating processes, in sharp contrast to traditional SiO2/based out-of-plane design and labor-intensive fabrication process. In-plane metallic emitter nozzles with 100 times longer effective nozzle length were fabricated consistently with high aspect ratio post arrays embedded within the nozzle as a flow homogenizer. The novelty of this work lies in that this integrated thruster/actuator provides a compact, reliable propulsion subsystem with the feasibility of thrust vectoring.
Keywords :
aerospace propulsion; electroplating; nozzles; photolithography; batch fabrication method; electroplating process; embedded flow homogenizer; flexible electrospray emitter; in-plane metallic emitter nozzles; metallic electrospray emitter; space propulsion; thrust vectoring; two-step photolithography; Fabrication; Force; Impedance; Liquids; Nickel; Propulsion; Substrates; Electrospray emitter; flow homogenizer; space propulsion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
Type :
conf
DOI :
10.1109/TRANSDUCERS.2015.7181385
Filename :
7181385
Link To Document :
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