• DocumentCode
    732037
  • Title

    A Flexible, metallic electrospray emitter with embedded flow homogenizer

  • Author

    Xiaochen Wang ; Cheng Li ; Weiwei Yang ; Weiwei Deng ; Cho, Hyoung J.

  • Author_Institution
    Mater. Sci. & Eng, Univ. of Central Florida, Orlando, FL, USA
  • fYear
    2015
  • fDate
    21-25 June 2015
  • Firstpage
    2152
  • Lastpage
    2155
  • Abstract
    This work reports a novel design and batch fabrication method of an electrospray emitter suitable for space propulsion. Our device only involves two-step photolithography and electroplating processes, in sharp contrast to traditional SiO2/based out-of-plane design and labor-intensive fabrication process. In-plane metallic emitter nozzles with 100 times longer effective nozzle length were fabricated consistently with high aspect ratio post arrays embedded within the nozzle as a flow homogenizer. The novelty of this work lies in that this integrated thruster/actuator provides a compact, reliable propulsion subsystem with the feasibility of thrust vectoring.
  • Keywords
    aerospace propulsion; electroplating; nozzles; photolithography; batch fabrication method; electroplating process; embedded flow homogenizer; flexible electrospray emitter; in-plane metallic emitter nozzles; metallic electrospray emitter; space propulsion; thrust vectoring; two-step photolithography; Fabrication; Force; Impedance; Liquids; Nickel; Propulsion; Substrates; Electrospray emitter; flow homogenizer; space propulsion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
  • Conference_Location
    Anchorage, AK
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2015.7181385
  • Filename
    7181385