High-power mems relay array with improved reliability and consistency

This paper presents a power MEMS relay array with numerous improvements in current-carrying capacity, which adopts silicon-on-insulator (SOI) anodic bonding technology to significantly improve the reliability and consistency of the relay matrix. The relay array is designed as a matrix of microcantilevers connected in parallel to allocate high power to individual relays. This method allows the relay matrix to be configured according to different power requirements. The proposed novel hollow suspended springs ensure that the microcantilevers driven by electrostatic parallel-plate actuators have small driving voltage and high stability.