Title :
Versatile CMOS-MEMS integrated piezoelectric platform
Author :
Tsai, J.M. ; Daneman, M. ; Boser, B. ; Horsley, D. ; Rais-Zadeh, M. ; Tang, H.Y. ; Lu, Y. ; Rozen, O. ; Liu, F. ; Lim, M. ; Assaderaghi, F.
Author_Institution :
InvenSense Inc., San Jose, CA, USA
Abstract :
We present the extension of the InvenSense fabrication platform to piezoelectric transduction. The newly proposed CMOS-MEMS Integrated Piezoelectric Platform inherits the wafer bonding advantages of its predecessor, leverages existing semiconductor infrastructure, and is applicable to a wide range of applications.
Keywords :
CMOS integrated circuits; micromechanical devices; piezoelectric transducers; wafer bonding; CMOS-MEMS integrated piezoelectric platform; InvenSense fabrication platform; piezoelectric transduction; semiconductor infrastructure; wafer bonding; Aluminum nitride; CMOS integrated circuits; Cavity resonators; III-V semiconductor materials; Micromechanical devices; Substrates; Varactors; CMOS integration; Fabrication platform; MEMS; piezoelectric;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
DOI :
10.1109/TRANSDUCERS.2015.7181409
