DocumentCode
73345
Title
Substrate Integrated Meandering Probe-Fed Patch Antennas for Wideband Wireless Devices
Author
Hang Wong ; Quan Wei Lin ; Hau Wah Lai ; Xiu Yin Zhang
Author_Institution
Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong, China
Volume
5
Issue
3
fYear
2015
fDate
Mar-15
Firstpage
381
Lastpage
388
Abstract
This paper presents novel linearly polarized (LP) and circularly polarized (CP) patch antennas for wideband wireless devices. Advanced electrical characteristics of the antennas including wide bandwidth, low cross polarization, low back radiation, and polarization insensitivity contribute to improve the signal quality of wireless connectivity. It is a realization of antenna foundation by employing multilayer microwave laminates to form a substrate integrated meandering probe-fed patch antenna. First, a design and analysis of the proposed patch antenna for LP operation is carried out. Based on the obtained results of this LP element, a substrate integrated meandering probe fed CP patch antenna is exhibited afterward. This paper is considered as a part of RF modules that could be integrated with other components like sensors, Microcontroller units, and electronic parts to form a wireless product by means of conventional packaging process.
Keywords
microstrip antennas; radio equipment; radio networks; substrate integrated waveguides; CP patch antennas; LP; advanced electrical characteristics; antenna foundation; circularly polarized; conventional packaging process; linearly polarized; low back radiation; low cross polarization; microcontroller units; multilayer microwave; polarization insensitivity; probe fed CP patch antenna; signal quality; substrate integrated meandering probe fed patch antennas; wide bandwidth; wideband wireless devices; wireless connectivity; wireless product; Antenna measurements; Bandwidth; Impedance; Patch antennas; Probes; Substrates; Antenna in package; low cross patch antenna; polarization; substrate integrated meandering probe; wideband antenna; wideband antenna.;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2015.2398846
Filename
7046358
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