• DocumentCode
    733658
  • Title

    Chip-based silica microspheres for cavity optomechanics

  • Author

    Xuefeng Jiang ; Kuzyk, Mark ; Thein Oo ; Hailin Wang

  • Author_Institution
    Dept. of Phys., Univ. of Oregon, Eugene, OR, USA
  • fYear
    2015
  • fDate
    10-15 May 2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We realized on-chip silica microspheres, featuring excellent thermal coupling to the silicon-wafer. These chip-based microspheres can overcome the problem of thermal bistability and are especially suitable for optomechanical studies in vacuum or at low temperature.
  • Keywords
    integrated optics; micro-optomechanical devices; microcavities; microfabrication; optical fabrication; silicon compounds; SiO2; cavity optomechanics; chip-based silica microspheres; low temperature; optomechanical studies; silicon wafer; thermal bistability; thermal coupling; vacuum; Optical bistability; Optical device fabrication; Optical fibers; Optical resonators; Silicon; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics (CLEO), 2015 Conference on
  • Conference_Location
    San Jose, CA
  • Type

    conf

  • Filename
    7184099
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=733658