DocumentCode
733748
Title
Multi-chip integration of lasers and silicon photonics by photonic wire bonding
Author
Billah, M. ; Hoose, T. ; Onanuga, T. ; Lindenmann, N. ; Dietrich, P. ; Wingert, T. ; Goedecke, M. ; Hofmann, A. ; Troppenz, U. ; Moehrle, M. ; Sigmund, A. ; Freude, W. ; Koos, C.
Author_Institution
Inst. of Photonics & Quantum Electron. (IPQ), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
fYear
2015
fDate
10-15 May 2015
Firstpage
1
Lastpage
2
Abstract
We demonstrate coupling of a horizontal-cavity surface-emitting laser (HCSEL) to a silicon photonic chip using photonic wire bonding. The technique does not require high-precision alignment of the chips. Measured coupling losses amount to approximately 4.2 dB.
Keywords
integrated optics; optical fabrication; optical losses; silicon; surface emitting lasers; HCSEL; coupling losses; high-precision alignment; horizontal-cavity surface-emitting laser; loss 4.2 dB; multichip integration; photonic wire bonding; silicon photonic chip; Bonding; Couplings; Optical waveguides; Silicon photonics; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics (CLEO), 2015 Conference on
Conference_Location
San Jose, CA
Type
conf
Filename
7184190
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