• DocumentCode
    734032
  • Title

    The estimation of IC wafers structural defects density with functional parameters

  • Author

    Gerasimov, Konstantin S. ; Sergeev, Pavel I.

  • Author_Institution
    Novosibirsk State Tech. Univ., Novosibirsk, Russia
  • fYear
    2015
  • fDate
    June 29 2015-July 3 2015
  • Firstpage
    97
  • Lastpage
    99
  • Abstract
    Method for estimation of structural defects density over whole wafer area by parametric wafer map creation is considered. This technique allows fast and accurate estimation of defects density over wafer area and in wafer batch. Input offset voltage of operational amplifer (op-amp) is calculated as a function of structural defects density and an example of corresponding parametric map is shown. The opportunity to localize the origin of structural defects on technological route is discussed.
  • Keywords
    integrated circuit testing; IC wafers structural defects density; functional parameters; input offset voltage; operational amplifer; parametric wafer map creation; wafer area; wafer batch; Correlation; Estimation; Integrated circuits; Semiconductor device measurement; Stacking; Surface treatment; Visualization; Parametric wafer maps; structural defects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro/Nanotechnologies and Electron Devices (EDM), 2015 16th International Conference of Young Specialists on
  • Conference_Location
    Erlagol
  • ISSN
    2325-4173
  • Print_ISBN
    978-1-4673-6718-9
  • Type

    conf

  • DOI
    10.1109/EDM.2015.7184498
  • Filename
    7184498