DocumentCode :
734032
Title :
The estimation of IC wafers structural defects density with functional parameters
Author :
Gerasimov, Konstantin S. ; Sergeev, Pavel I.
Author_Institution :
Novosibirsk State Tech. Univ., Novosibirsk, Russia
fYear :
2015
fDate :
June 29 2015-July 3 2015
Firstpage :
97
Lastpage :
99
Abstract :
Method for estimation of structural defects density over whole wafer area by parametric wafer map creation is considered. This technique allows fast and accurate estimation of defects density over wafer area and in wafer batch. Input offset voltage of operational amplifer (op-amp) is calculated as a function of structural defects density and an example of corresponding parametric map is shown. The opportunity to localize the origin of structural defects on technological route is discussed.
Keywords :
integrated circuit testing; IC wafers structural defects density; functional parameters; input offset voltage; operational amplifer; parametric wafer map creation; wafer area; wafer batch; Correlation; Estimation; Integrated circuits; Semiconductor device measurement; Stacking; Surface treatment; Visualization; Parametric wafer maps; structural defects;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro/Nanotechnologies and Electron Devices (EDM), 2015 16th International Conference of Young Specialists on
Conference_Location :
Erlagol
ISSN :
2325-4173
Print_ISBN :
978-1-4673-6718-9
Type :
conf
DOI :
10.1109/EDM.2015.7184498
Filename :
7184498
Link To Document :
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