DocumentCode
734032
Title
The estimation of IC wafers structural defects density with functional parameters
Author
Gerasimov, Konstantin S. ; Sergeev, Pavel I.
Author_Institution
Novosibirsk State Tech. Univ., Novosibirsk, Russia
fYear
2015
fDate
June 29 2015-July 3 2015
Firstpage
97
Lastpage
99
Abstract
Method for estimation of structural defects density over whole wafer area by parametric wafer map creation is considered. This technique allows fast and accurate estimation of defects density over wafer area and in wafer batch. Input offset voltage of operational amplifer (op-amp) is calculated as a function of structural defects density and an example of corresponding parametric map is shown. The opportunity to localize the origin of structural defects on technological route is discussed.
Keywords
integrated circuit testing; IC wafers structural defects density; functional parameters; input offset voltage; operational amplifer; parametric wafer map creation; wafer area; wafer batch; Correlation; Estimation; Integrated circuits; Semiconductor device measurement; Stacking; Surface treatment; Visualization; Parametric wafer maps; structural defects;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro/Nanotechnologies and Electron Devices (EDM), 2015 16th International Conference of Young Specialists on
Conference_Location
Erlagol
ISSN
2325-4173
Print_ISBN
978-1-4673-6718-9
Type
conf
DOI
10.1109/EDM.2015.7184498
Filename
7184498
Link To Document