On-chip and in-package antennas for mm-Wave CMOS circuits

Author

Van Thienen, Niels ; Steyaert, Wouter ; Zhang, Yang ; Reynaert, Patrick

Author_Institution

ESAT/MICAS, KU Leuven, Leuven, Belgium

fYear

2015

fDate

13-17 April 2015

Firstpage

1

Lastpage

5

Abstract

This paper discusses challenges, design issues and possible solutions to get mm-Wave signals off-chip. Simulationand measurement results are discussed for three mm-Wave designs at different frequencies in bulk CMOS technology. (1) The design of a back-to-back IC-to-board interconnect using wire-bonding and microstrip lines is described to package and measure the chips without the need for a mm-Wave probe. (2) An on-chip antenna implementation at 540GHz in a 40nm CMOS technology with metal reflector is discussed. And (3) an on-chip collinear broadside array at 120GHz, also designed in a 40nm CMOS technology and flip-chipped on an alumina substrate is proposed as a possible solution.

Keywords

CMOS integrated circuits; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; lead bonding; microstrip lines; millimetre wave antennas; millimetre wave integrated circuits; reflector antennas; alumina substrate; back-to-back IC-to-board interconnect; bulk CMOS technology; flip-chipped; frequency 120 GHz; frequency 540 GHz; in-package antennas; metal reflector; microstrip lines; mm-Wave CMOS circuits; on-chip antennas; size 40 nm; wire-bonding; Antenna measurements; Antennas; CMOS integrated circuits; Frequency measurement; Metals; Substrates; System-on-chip; CMOS; in-package antenna; mm-Wave; on-chip antenna;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (EuCAP), 2015 9th European Conference on

Conference_Location

Lisbon

Type

conf

Filename

7228504