DocumentCode :
735335
Title :
Technology innovation in an IoT Era
Author :
Steegen, An
Author_Institution :
imec, Leuven, Belgium
fYear :
2015
fDate :
17-19 June 2015
Abstract :
The further growth of billions of wirelessly connected devices requires a technology infrastructure that can handle a massive increase in storage, computing power and bandwidth, some of it available via cloud computing, to enable number crunching at very large scale and at high volume, low cost and low power. The IoT applications or ‘smart devices’ require the following technology enablers: ultra-low power, integration of memory and processing power to drive context awareness, security, advanced communication using smart antennas and improved analog performance, compactness by co-integration or stacking of heterogeneous systems.
Keywords :
Bandwidth; Electrostatics; FinFETs; Internet of things; Logic gates; Performance evaluation; Technological innovation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Circuits (VLSI Circuits), 2015 Symposium on
Conference_Location :
Kyoto, Japan
Print_ISBN :
978-4-86348-502-0
Type :
conf
DOI :
10.1109/VLSIC.2015.7231370
Filename :
7231370
Link To Document :
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