• DocumentCode
    735343
  • Title

    A 14 nm SoC platform technology featuring 2nd generation Tri-Gate transistors, 70 nm gate pitch, 52 nm metal pitch, and 0.0499 um2 SRAM cells, optimized for low power, high performance and high density SoC products

  • Author

    Jan, C.-H. ; Al-amoody, F. ; Chang, H.-Y. ; Chang, T. ; Chen, Y.-W. ; Dias, N. ; Hafez, W. ; Ingerly, D. ; Jang, M. ; Karl, E. ; Shi, S.K.-Y. ; Komeyli, K. ; Kilambi, H. ; Kumar, A. ; Byon, K. ; Lee, C.-G. ; Lee, J. ; Leo, T. ; Liu, P.-C. ; Nidhi, N. ; Ol

  • Author_Institution
    Logic Technology Development, Intel Corporation, Hillsboro, Oregon, USA
  • fYear
    2015
  • fDate
    17-19 June 2015
  • Abstract
    A leading edge 14 nm SoC platform technology based upon the 2nd generation Tri-Gate transistor technology [5] has been optimized for density, low power and wide dynamic range. 70 nm gate pitch, 52 nm metal pitch and 0.0499 um2 HDC SRAM cells are the most aggressive design rules reported for 14/16 nm node SoC process to achieve Moore´s Law 2x density scaling over 22 nm node. High performance NMOS/PMOS drive currents of 1.3/1.2 mA/um, respectively, have been achieved at 0.7 V and 100 nA/um off-state leakage, 37%/50% improvement over 22 nm node. Ultra-low power NMOS/PMOS drives are 0.50/0.32 mA/um at 0.7 V and 15pA/um Ioff. This technology also deploys high voltage I/O transistors to support up to 3.3 V I/O. A full suite of analog, mixed-signal and RF features are also supported.
  • Keywords
    Logic gates; MOS devices; Market research; Metals; Random access memory; System-on-chip; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Circuits (VLSI Circuits), 2015 Symposium on
  • Conference_Location
    Kyoto, Japan
  • Print_ISBN
    978-4-86348-502-0
  • Type

    conf

  • DOI
    10.1109/VLSIC.2015.7231380
  • Filename
    7231380