DocumentCode :
73573
Title :
Surrogate-Based Analysis and Optimization for the Design of Heat Sinks With Jet Impingement
Author :
Xueguan Song ; Jie Zhang ; Sanghoon Kang ; Mingyao Ma ; Bing Ji ; Wenping Cao ; Pickert, Volker
Author_Institution :
Sch. of Electr. & Electron. Eng., Newcastle Univ., Newcastle upon Tyne, UK
Volume :
4
Issue :
3
fYear :
2014
fDate :
Mar-14
Firstpage :
429
Lastpage :
437
Abstract :
Heat sinks are widely used for cooling electronic devices and systems. Their thermal performance is usually determined by the material, shape, and size of the heat sink. With the assistance of computational fluid dynamics (CFD) and surrogate-based optimization, heat sinks can be designed and optimized to achieve a high level of performance. In this paper, the design and optimization of a plate-fin-type heat sink cooled by impingement jet is presented. The flow and thermal fields are simulated using the CFD simulation; the thermal resistance of the heat sink is then estimated. A Kriging surrogate model is developed to approximate the objective function (thermal resistance) as a function of design variables. Surrogate-based optimization is implemented by adaptively adding infill points based on an integrated strategy of the minimum value, the maximum mean square error approach, and the expected improvement approaches. The results show the influence of design variables on the thermal resistance and give the optimal heat sink with lowest thermal resistance for given jet impingement conditions.
Keywords :
computational fluid dynamics; cooling; heat sinks; jets; least mean squares methods; sensitivity analysis; thermal resistance; CFD simulation; GSA; Kriging surrogate model; computational fluid dynamics; design variable function; electronic device cooling; global sensitivity analysis; heat sink design; jet impingement conditions; maximum mean square error approach; objective function; plate-fin-type heat sink; surrogate-based analysis; surrogate-based optimization; thermal resistance; Computational fluid dynamics; Computational modeling; Heat sinks; Heat transfer; Mathematical model; Optimization; Thermal resistance; Computational fluid dynamics (CFD); design optimization; global sensitivity analysis (GSA); heat sinks; impingement; surrogate;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2285812
Filename :
6650116
Link To Document :
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