Title :
SU-8 piezoresistive microcantilever with high gauge factor
Author :
Lee Kok Siong ; Abdul Azid, Ishak ; Sidek, Othman ; Ibrahim, Khalil ; Devarajan, Mutharasu
Author_Institution :
Sch. of Mech. Eng., Univ. Sains Malaysia, Nibong Tebal, Malaysia
fDate :
3/1/2013 12:00:00 AM
Abstract :
Presented is an SU-8 microcantilever sensor with integrated piezoresistors made of a mixture of SU-8 polymer and silver nanoparticles. The resulting composite is a spin-coatable and ultraviolet patternable conductive polymer, which can be easily incorporated with any SU-8-based microdevice. The microfabrication technique used in this work is based on adhesive bonding of the cantilever layers with the thick support base to obtain a three-dimensional structures device, which is a cost-effective and fast fabrication process. Based on the current-voltage (I-V) test, the fabricated piezoresistors exhibit a linear resistance characteristic with good conductivity. The gauge factor calculated from the deflection test was obtained to be as high as 26.3, demonstrating the capability for embedded SU-8/Ag piezoresistors to improve sensitivity when using polymeric material as a sensor platform.
Keywords :
adhesive bonding; cantilevers; conducting polymers; microfabrication; micromechanical devices; nanoparticles; piezoresistive devices; resistors; silver; 3D structure device; Ag; SU-8 piezoresistive microcantilever; SU-8 polymer; SU-8-Ag piezoresistors; SU-8-based microdevice; adhesive bonding; current-voltage test; deflection test; gauge factor; integrated piezoresistors; microfabrication technique; polymeric material; silver nanoparticles; spin-coatable composite; ultraviolet patternable conductive polymer;
Journal_Title :
Micro & Nano Letters, IET
DOI :
10.1049/mnl.2012.0736