DocumentCode :
738108
Title :
Three-Dimensional Integration of Complementary Metal-Oxide-Semiconductor-Nanoelectromechanical Hybrid Reconfigurable Circuits
Author :
Woo Young Choi ; Yong Jun Kim
Author_Institution :
Sogang Univ., Seoul, South Korea
Volume :
36
Issue :
9
fYear :
2015
Firstpage :
887
Lastpage :
889
Abstract :
Complementary-metal-oxide-semiconductor(CMOS) and nanoelectromechanical (NEM) hybrid reconfigurable circuits are implemented for the first time using three-dimensional (3D) integration process. In addition, their operation is confirmed experimentally. For the fabrication of the 3D CMOS-NEM hybrid reconfigurable circuits, only the standard CMOS baseline process has been used except for the hydrofluoric acid vapor etch to release the NEM structures and focused-ion-beam patterning to define small patterns.
Keywords :
CMOS integrated circuits; focused ion beam technology; hybrid integrated circuits; nanoelectromechanical devices; 3D CMOS-NEM hybrid reconfigurable circuits; NEM structures; complementary metal oxide semiconductor circuits; focused ion beam patterning; nanoelectromechanical hybrid reconfigurable circuits; standard CMOS baseline process; three-dimensional integration; CMOS integrated circuits; Inverters; Metals; Optical switches; Switching circuits; Three-dimensional displays; Complementary-metal-oxide-semiconductor (CMOS); complementary-metal-oxide-semiconductor (CMOS); nano-electromechanical (NEM) memory switch; reconfigurable cicuit; three-dimensional (3D) integration;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2015.2455556
Filename :
7155499
Link To Document :
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