Title :
Cyclic Bending Reliability of Silk Screen Printed Silver Traces on Plastic and Paper Substrates
Author :
Happonen, Tuomas ; Hakkinen, Juha ; Fabritius, Tapio
Author_Institution :
Lab. of Optoelectron. & Meas. Tech., Univ. of Oulu, Oulu, Finland
Abstract :
The effect of the substrate on the cyclic bending reliability of screen printed silver traces is studied in this paper. The silver screen printed test samples in this study were three different plastic films and three varieties of paper sheets. The specimens with line widths of 250, 500, 1000, and 2000 μm were subjected to cyclic bending, and their electrical behavior was monitored with dc resistance measurements in situ. In this study, a 20% increase in resistance was defined as the failure criterion, and the reliability of each test population was assessed by a statistical Weibull analysis. The results showed that the reliability of the traces was highly dependent on the substrate thickness in all the studied materials. The traces on a 125-μm-thick polyethylene terephthalate substrate were found to have the lowest characteristic lifetimes of about 1000 bending cycles, whereas the traces with the same geometry on polyethylene terephthalate with a thickness of 50 μm endured hundreds of thousands of bending cycles. Similarly, decreasing the substrate thickness improved the reliability of the printed traces on paper substrates. This relationship was due to the reduced mechanical strain on the trace surface when using thinner substrates.
Keywords :
Weibull distribution; bending; paper; printed circuit testing; reliability; substrates; thick films; bending cycles; cyclic bending reliability; dc resistance measurements; mechanical strain; paper sheets; paper substrates; plastic films; polyethylene terephthalate substrate; printed traces reliability; screen printed silver traces; silver screen printed test samples; size 1000 mum; size 125 mum; size 2000 mum; size 250 mum; size 50 mum; size 500 mum; statistical Weibull analysis; substrate thickness; trace surface; Electrical resistance measurement; Positron emission tomography; Reliability; Resistance; Sociology; Statistics; Substrates; Bending test; paper sheet; plastic film; printed trace; reliability; screen printing; strain;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2015.2457231