• DocumentCode
    738476
  • Title

    Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures

  • Author

    Wenwen Chai ; Dan Jiao

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    101
  • Issue
    2
  • fYear
    2013
  • Firstpage
    372
  • Lastpage
    388
  • Abstract
    We develop a linear-complexity direct matrix solution for the surface integral equation (IE)-based impedance extraction of arbitrarily shaped 3-D nonideal conductors embedded in a dielectric material. A direct inverse of a highly irregular system matrix composed of both dense and sparse matrix blocks is obtained in O(N) complexity with N being the matrix size. It outperforms state-of-the-art impedance solvers, be they direct solvers or iterative solvers, with fast central processing unit (CPU) time, modest memory consumption, and without sacrificing accuracy, for both small and large number of unknowns. The inverse of a 2.68-million-unknown matrix arising from the extraction of a large-scale 3-D interconnect having 128 buses, which is a matrix solution for 2.68 million right-hand sides, was obtained in less than 1.5 GB memory and 1.3 h on a single CPU running at 3 GHz.
  • Keywords
    circuit complexity; conductors (electric); dielectric materials; electric impedance; integral equations; sparse matrices; 3D nonideal conductor; CPU time; IE-based impedance extraction; central processing unit; complicated 3D structure; dense matrix block; dielectric material; impedance solver; irregular system matrix; iterative solver; linear-complexity direct matrix solution; memory consumption; sparse matrix block; surface integral equation; Central Processing Unit; Complexity theory; Conductors; Dielectric materials; Impedance; Integral equations; Sparse matrices; Surface impedance; Direct solvers; electromagnetic analysis; fast integral equation (IE) solvers; impedance extraction; interconnects;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2012.2190577
  • Filename
    6210344