DocumentCode
738476
Title
Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures
Author
Wenwen Chai ; Dan Jiao
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
101
Issue
2
fYear
2013
Firstpage
372
Lastpage
388
Abstract
We develop a linear-complexity direct matrix solution for the surface integral equation (IE)-based impedance extraction of arbitrarily shaped 3-D nonideal conductors embedded in a dielectric material. A direct inverse of a highly irregular system matrix composed of both dense and sparse matrix blocks is obtained in O(N) complexity with N being the matrix size. It outperforms state-of-the-art impedance solvers, be they direct solvers or iterative solvers, with fast central processing unit (CPU) time, modest memory consumption, and without sacrificing accuracy, for both small and large number of unknowns. The inverse of a 2.68-million-unknown matrix arising from the extraction of a large-scale 3-D interconnect having 128 buses, which is a matrix solution for 2.68 million right-hand sides, was obtained in less than 1.5 GB memory and 1.3 h on a single CPU running at 3 GHz.
Keywords
circuit complexity; conductors (electric); dielectric materials; electric impedance; integral equations; sparse matrices; 3D nonideal conductor; CPU time; IE-based impedance extraction; central processing unit; complicated 3D structure; dense matrix block; dielectric material; impedance solver; irregular system matrix; iterative solver; linear-complexity direct matrix solution; memory consumption; sparse matrix block; surface integral equation; Central Processing Unit; Complexity theory; Conductors; Dielectric materials; Impedance; Integral equations; Sparse matrices; Surface impedance; Direct solvers; electromagnetic analysis; fast integral equation (IE) solvers; impedance extraction; interconnects;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/JPROC.2012.2190577
Filename
6210344
Link To Document