Title :
Back-End Deposited Silicon Photonics for Monolithic Integration on CMOS
Author :
Lee, Y.H.D. ; Lipson, Michal
Author_Institution :
Dept. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
Abstract :
We present the vision of back-end deposited silicon photonics (BDSP) and review works that have been done in this field. Individual aspects of BDSP platform including excimer-laser-annealed polycrystalline silicon, low-loss plasma-enhanced chemical vapor deposition silicon nitride waveguide, modulator, detector, electrical interface, back-end CMOS compatibility, and benefits of the platform are discussed in detail.
Keywords :
CMOS integrated circuits; elemental semiconductors; excimer lasers; laser beam annealing; plasma CVD; silicon; BDSP platform; Si; back-end CMOS compatibility; back-end deposited silicon photonics; detector; electrical interface; excimer-laser-annealed polycrystalline silicon; low-loss plasma-enhanced chemical vapor deposition silicon nitride waveguide; modulator; monolithic integration; CMOS integrated circuits; Optical losses; Optical ring resonators; Optical waveguides; Photonics; Silicon; Silicon compounds; CMOS technology; excimer laser annealing (ELA); integrated optics; optical modulators; photodetectors; polycrystalline silicon; silicon nitride (SiN); silicon photonics (SiP);
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2012.2209865
