DocumentCode
739615
Title
On the Yield of Millimeter-Wave Bond-Wire-Antennas in High Volume Production
Author
Johannsen, U. ; Smolders, A.B.
Author_Institution
Eindhoven Univ. of Technol., Eindhoven, Netherlands
Volume
61
Issue
8
fYear
2013
Firstpage
4363
Lastpage
4366
Abstract
For the development of highly integrated millimeter-wave front-end modules, a low-cost and high-performance antenna technology is of paramount importance. Here, standard wire-bond technology is a very attractive candidate due to its widespread availability, computationally efficient modeling options, and promising performance as an antenna. A concern often stated with respect to antennas in this technology, however, is its expected low yield in high volume production. This concern is addressed in this communication by means of a dedicated, computationally efficient antenna model in conjunction with standard deviations of state-of-the-art wire-bonders. The results indicate a possible yield of larger than 99.9% for operating frequencies of up to 250 GHz.
Keywords
lead bonding; millimetre wave antennas; reliability; wire antennas; high volume production; highly integrated millimeter-wave front-end module; millimeter-wave bond-wire-antenna; standard wire-bond technology; Millimeter wave communication; millimeter wave integrated circuits; millimeter wave technology;
fLanguage
English
Journal_Title
Antennas and Propagation, IEEE Transactions on
Publisher
ieee
ISSN
0018-926X
Type
jour
DOI
10.1109/TAP.2013.2259456
Filename
6507292
Link To Document