• DocumentCode
    739615
  • Title

    On the Yield of Millimeter-Wave Bond-Wire-Antennas in High Volume Production

  • Author

    Johannsen, U. ; Smolders, A.B.

  • Author_Institution
    Eindhoven Univ. of Technol., Eindhoven, Netherlands
  • Volume
    61
  • Issue
    8
  • fYear
    2013
  • Firstpage
    4363
  • Lastpage
    4366
  • Abstract
    For the development of highly integrated millimeter-wave front-end modules, a low-cost and high-performance antenna technology is of paramount importance. Here, standard wire-bond technology is a very attractive candidate due to its widespread availability, computationally efficient modeling options, and promising performance as an antenna. A concern often stated with respect to antennas in this technology, however, is its expected low yield in high volume production. This concern is addressed in this communication by means of a dedicated, computationally efficient antenna model in conjunction with standard deviations of state-of-the-art wire-bonders. The results indicate a possible yield of larger than 99.9% for operating frequencies of up to 250 GHz.
  • Keywords
    lead bonding; millimetre wave antennas; reliability; wire antennas; high volume production; highly integrated millimeter-wave front-end module; millimeter-wave bond-wire-antenna; standard wire-bond technology; Millimeter wave communication; millimeter wave integrated circuits; millimeter wave technology;
  • fLanguage
    English
  • Journal_Title
    Antennas and Propagation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-926X
  • Type

    jour

  • DOI
    10.1109/TAP.2013.2259456
  • Filename
    6507292