DocumentCode
740274
Title
Message from the symposium general chair 2015 IEEE symposium on electromagnetic compatibility and signal integrity
Author
Chan, Caroline
Volume
4
Issue
2
fYear
2015
Firstpage
50
Lastpage
50
Abstract
I would like to thank YOU — all the 1,400+ attendees, exhibitors, volunteers — who came to Santa Clara for the 2015 IEEE Symposium on EMC and SI. You brought us success in the famous Silicon Valley. We started with the registration on Sunday by distributing the awesome grocery insulation bags that the team had chosen this year. This was the obvious choice as you have to bring your own bags for grocery shopping in California.
fLanguage
English
Journal_Title
Electromagnetic Compatibility Magazine, IEEE
Publisher
ieee
ISSN
2162-2264
Type
jour
DOI
10.1109/MEMC.2015.7204049
Filename
7204049
Link To Document