• DocumentCode
    740274
  • Title

    Message from the symposium general chair 2015 IEEE symposium on electromagnetic compatibility and signal integrity

  • Author

    Chan, Caroline

  • Volume
    4
  • Issue
    2
  • fYear
    2015
  • Firstpage
    50
  • Lastpage
    50
  • Abstract
    I would like to thank YOU — all the 1,400+ attendees, exhibitors, volunteers — who came to Santa Clara for the 2015 IEEE Symposium on EMC and SI. You brought us success in the famous Silicon Valley. We started with the registration on Sunday by distributing the awesome grocery insulation bags that the team had chosen this year. This was the obvious choice as you have to bring your own bags for grocery shopping in California.
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    2162-2264
  • Type

    jour

  • DOI
    10.1109/MEMC.2015.7204049
  • Filename
    7204049