• DocumentCode
    740276
  • Title

    Message from the technical program chair 2015 IEEE symposium on electromagnetic compatibility and signal integrity

  • Author

    Fan, Jun

  • Volume
    4
  • Issue
    2
  • fYear
    2015
  • Firstpage
    50
  • Lastpage
    51
  • Abstract
    On behalf of the Technical Program Committee, we thank all the attendees of the 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (EMCSI2015) in Santa Clara, California! This symposium was a special venue for those who may not have been able to travel to Dresden, Germany for the annual IEEE International Symposium on EMC. However, its technical program was no less in quality at all, with tremendous effort from everyone including the authors/speakers, reviewers, Technical Advisory Committee (TAC) and Technical Program Committee (TPC) members! I have received lots of feedback. None of it was negative!
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    2162-2264
  • Type

    jour

  • DOI
    10.1109/MEMC.2015.7204050
  • Filename
    7204050