DocumentCode
740276
Title
Message from the technical program chair 2015 IEEE symposium on electromagnetic compatibility and signal integrity
Author
Fan, Jun
Volume
4
Issue
2
fYear
2015
Firstpage
50
Lastpage
51
Abstract
On behalf of the Technical Program Committee, we thank all the attendees of the 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (EMCSI2015) in Santa Clara, California! This symposium was a special venue for those who may not have been able to travel to Dresden, Germany for the annual IEEE International Symposium on EMC. However, its technical program was no less in quality at all, with tremendous effort from everyone including the authors/speakers, reviewers, Technical Advisory Committee (TAC) and Technical Program Committee (TPC) members! I have received lots of feedback. None of it was negative!
fLanguage
English
Journal_Title
Electromagnetic Compatibility Magazine, IEEE
Publisher
ieee
ISSN
2162-2264
Type
jour
DOI
10.1109/MEMC.2015.7204050
Filename
7204050
Link To Document