DocumentCode :
740276
Title :
Message from the technical program chair 2015 IEEE symposium on electromagnetic compatibility and signal integrity
Author :
Fan, Jun
Volume :
4
Issue :
2
fYear :
2015
Firstpage :
50
Lastpage :
51
Abstract :
On behalf of the Technical Program Committee, we thank all the attendees of the 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (EMCSI2015) in Santa Clara, California! This symposium was a special venue for those who may not have been able to travel to Dresden, Germany for the annual IEEE International Symposium on EMC. However, its technical program was no less in quality at all, with tremendous effort from everyone including the authors/speakers, reviewers, Technical Advisory Committee (TAC) and Technical Program Committee (TPC) members! I have received lots of feedback. None of it was negative!
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility Magazine, IEEE
Publisher :
ieee
ISSN :
2162-2264
Type :
jour
DOI :
10.1109/MEMC.2015.7204050
Filename :
7204050
Link To Document :
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