Title :
Design Aspects of an Antenna-MMIC Interface Using a Stacked Patch at 71–86 GHz
Author :
Smith, Stephen L. ; Merkle, Thomas ; Smart, Ken W. ; Hay, Stuart G. ; Mei Shen ; Ceccato, F.
Author_Institution :
ICT Centre, Wireless & Networking Technol. Lab., CSIRO, Marsfield, NSW, Australia
fDate :
4/1/2013 12:00:00 AM
Abstract :
A bond-wire-free interconnection between monolithic microwave integrated circuit (MMIC) and antenna using a stacked patch configuration is investigated. An edge-fed patch on a gallium arsenide (GaAs) MMIC chip drives a patch antenna integrated in the lid of the MMIC package. The lid is formed using a liquid crystal polymer (LCP) substrate. The first implementation using a laminated multichip module (MCM-L) process is presented that covers the designated E-band spectrum for long-range wireless communications (71-86 GHz). Electromagnetic simulations and measurements of antenna radiation patterns agree well over the whole frequency range of interest. Important design aspects and manufacturing tolerances specific for the implementation of the interface in MCM-L millimeter-wave front-ends are presented. An alternative design is proposed for improved radiation patterns across the band.
Keywords :
III-V semiconductors; MIMIC; MMIC; antenna feeds; antenna radiation patterns; gallium arsenide; liquid crystal polymers; microstrip antennas; millimetre wave antennas; multichip modules; E-band spectrum; GaAs; LCP substrate; MCM-L millimeter-wave front-ends; MCM-L process; MMIC package; antenna radiation pattern measurements; antenna-MMIC interface design; edge-fed patch; electromagnetic simulations; frequency 71 GHz to 86 GHz; gallium arsenide MMIC chip; laminated multichip module process; liquid crystal polymer substrate; long-range wireless communications; monolithic microwave integrated circuit; patch antenna; stacked patch configuration; Antenna measurements; Antenna radiation patterns; Frequency measurement; Gain; Gallium arsenide; Microstrip; Waveguide transitions; Active antennas; microstrip antennas; microwave integrated circuits (MICs); millimeter wave antennas; multichip modules;
Journal_Title :
Antennas and Propagation, IEEE Transactions on
DOI :
10.1109/TAP.2013.2239251
