Title :
Graphene Field-Effect Transistors Based on Boron–Nitride Dielectrics
Author :
Meric, Inanc ; Dean, C.R. ; Petrone, Nicholas ; Lei Wang ; Hone, James ; Kim, Peter ; Shepard, Kenneth L.
Author_Institution :
Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
fDate :
7/1/2013 12:00:00 AM
Abstract :
Two-dimensional atomic sheets of graphene represent a new class of nanoscale materials with potential applications in electronics. However, exploiting the intrinsic characteristics of graphene devices has been problematic due to impurities and disorder in the surrounding dielectric and graphene/dielectric interfaces. Recent advancements in fabricating graphene heterostructures by alternately layering graphene with crystalline hexagonal boron nitride (hBN), its insulating isomorph, have led to an order of magnitude improvement in graphene device quality. Here, recent developments in graphene devices utilizing boron-nitride dielectrics are reviewed. Field-effect transistor (FET) characteristics of these systems at high bias are examined. Additionally, existing challenges in material synthesis and fabrication and the potential of graphene/BN heterostructures for novel electronic applications are discussed.
Keywords :
boron compounds; dielectric devices; field effect transistors; graphene; impurities; nanoelectronics; FET characteristics; boron-nitride dielectrics; crystalline hexagonal boron nitride; electronic application; graphene device intrinsic characteristics; graphene device quality; graphene field-effect transistor; graphene heterostructure; graphene/BN heterostructure fabrication; graphene/dielectric interface; impurity; insulating isomorph; layering graphene; magnitude improvement; material synthesis; nanoscale material; two-dimensional atomic sheet; Conductivity; Dielectric measurement; Dielectrics; Field effect transistors; Graphene; Logic gates; Temperature measurement; Transistors; Graphene field-effect transistors (GFETs); hexagonal boron nitride (hBN);
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/JPROC.2013.2257634