Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints

Sn-Ag-Cu (SAC) solder alloys, such as Sn-3.0Ag-0.5 Cu (SAC305) are the popular choices of lead-free solders replacing SnPb solders. However, SAC solders are more brittle in nature due to stiffness and excessive intermetallic compounds growth at the solder joint to pad interface. This leads to higher risk of solder joints failures. Memory module-type smaller lead-free ball grid array (BGA) packages are constantly under dynamic stresses during handling and thermal stresses during operations. It is important to understand the dynamic performance and long-term reliability of memory module lead-free BGAs. It is believed that the printed circuit board (PCB) design variations cause dynamic and long-term failure discrepancies in the fields. In this paper, different pad and trace designs are introduced to evaluate the effects of PCB design variations on the bend and accelerated thermal cycling (ATC) performance of lead-free solder joints. Pad designs with nonsolder mask defined, solder mask defined (SMD), and a unique web design are assembled and tested. Different solder alloys, including SAC305, Sn-1.0Ag-0.5Cu (SAC105) SAC105, and SnPb solders, have been evaluated in this paper. Different PCB materials have also been evaluated in the test. Four-point monotonic bend tests are performed to characterize the bending performance variations with different PCB designs and compared with conventional Sn-Pb solder. The SMD pad is shown to have the best bend performance among all other types of designs in this paper. In addition, this design also shows improvement in mitigation of PCB pad cratering with lead-free solders. Wide trace width seems to degrade the strength and is not preferred. Just as it shows superior shock resistance when compared with SAC305, the SAC105 solder alloy also shows better bend performance. There is no significant improvement in bend performance with web design. After aging treatment, bend performance of both SAC305 and SAC105 degraded by up to 34% and 29%,- respectively. However, the bend performance of eutectic SnPb is actually improved after aging. ATC tests are performed to investigate the effects of design variations on the long-term reliability of lead-free solder joints; SMD design shows less reliability life than others. The implications of these results for the reliability of lead-free solder joints are discussed in this paper.