Title :
Role of Transparent Die Attach Adhesives for Enhancing Lumen Output of Midpower LED Emitters With Standard MESA Structure
Author :
Yu-Chou Shih ; Gunwoo Kim ; Linjuan Huang ; Jiun-Pyng You ; Shi, Frank G.
Author_Institution :
Optoelectron. Packaging & Mater. Labs., Univ. of California at Irvine, Irvine, CA, USA
fDate :
6/1/2015 12:00:00 AM
Abstract :
The role of die attach adhesives (DAAs) in influencing the lumen output of midpower (30-150-mA input power) blue and white light emitting diodes (LEDs), which currently dominate the LED backlighting and general solid-state lighting, is studied. It is reported for the first time that a replacement of conventional silver-filled epoxy DAA by an optically transparent DAA can lead to a significant enhancement of light output as high as 13% and 21% increase for midpower blue and white LEDs, respectively. The mechanism for the observed enhancement is discussed in this paper.
Keywords :
adhesives; light emitting diodes; microassembling; DAA role; LED backlighting; conventional silver-filled epoxy DAA; current 30 mA to 150 mA; general solid-state lighting; light output enhancement; lumen output enhancement; midpower LED emitters; midpower blue light emitting diodes; midpower white light emitting diodes; optically-transparent DAA; standard MESA structure; transparent die attach adhesive; Light emitting diodes; Microassembly; Optical materials; Optical variables measurement; Packaging; Photonics; Stimulated emission; Die attach adhesive (DAA); light emitting diodes (LEDs); midpower LED; silicone; silicone.;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2015.2433922
