The Design of Broadband 60 GHz AMC Antenna in Multi-Chip RF Data Transmission

Author

Ho-Hsin Yeh ; Hiramatsu, N. ; Melde, Kathleen L.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA

Volume

61

Issue

4

fYear

2013

fDate

4/1/2013 12:00:00 AM

Firstpage

1623

Lastpage

1630

Abstract

This paper presents the design of a 60 GHz antenna to be used in multi-core multi-chip (MCMC) computing systems. The antenna in package (AiP) solution has a ground-shielded metal and a periodically-patched artificial magnetic conductor (AMC) structure to widen the reflection coefficient bandwidth. The designed antenna with AMC layer broadcasts signals in the horizontal direction. Both simulated and measured results demonstrate that a -10 dB reflection coefficient is achieved for a 10 GHz bandwidth and that radiation in the horizontal (chip-to-chip) direction is maintained.

Keywords

broadband antennas; electronics packaging; millimetre wave antennas; millimetre wave integrated circuits; multichip modules; AMC layer broadcast signals; AMC structure; AiP solution; MCMC computing systems; antenna in package solution; bandwidth 10 GHz; broadband AMC antenna; ground-shielded metal; horizontal direction; multichip RF data transmission; multichip module; multicore multichip computing systems; periodically-patched artificial magnetic conductor structure; reflection coefficient bandwidth; Antenna measurements; Antennas; Bandwidth; Conductors; Dielectrics; Silicon; 60 GHz antennas; Antenna-in-package; electronic packaging; printed antenna;

fLanguage

English

Journal_Title

Antennas and Propagation, IEEE Transactions on

Publisher

ieee

ISSN

0018-926X

Type

jour

DOI

10.1109/TAP.2012.2232895

Filename

6376105