Title :
A 3-d broadband dual-layer multiaperture microstrip directional coupler
Author :
Wang, Chunlei ; Chang, Kai
Author_Institution :
Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
fDate :
5/1/2002 12:00:00 AM
Abstract :
A three-dimensional (3-D) broadband dual-layer multiaperature microstrip directional coupler is presented in this paper. The dual-layer, multiaperature directional coupler consists of two-layer back-to-back substrates with 15 small coupling apertures on the center ground plane. A novel rectangular multiaperature coupling structure with very small width is used to greatly extend the bandwidth and operating frequency of the coupler. The /spl plusmn/2.4 dB coupling variation bandwidth of the couplers is more than 1.5 octaves from 9.79 to 29.55 GHz. The insertion losses, return losses at all ports and directivities, are better than 1.7 dB, 10.26 dB, and 10.3 dB over the bandwidth, respectively. The measurements agree well with the simulations.
Keywords :
microstrip directional couplers; packaging; 1.7 dB; 10.26 dB; 3D broadband directional coupler; 9.79 to 29.55 GHz; dual-layer directional coupler; microstrip directional coupler; multiaperature directional coupler; packaging; rectangular multi-aperature coupling structure; three-dimensional structure; two-layer back-to-back substrates; Apertures; Bandwidth; Coupling circuits; Directional couplers; Microstrip; Microwave circuits; Microwave devices; Nonhomogeneous media; Polynomials; Radio frequency;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/7260.1000189