DocumentCode
745041
Title
Role of scattering in nanotransistors
Author
Svizhenko, Alexei ; Anantram, M.P.
Author_Institution
NASA Ames Res. Center, Moffett Field, CA, USA
Volume
50
Issue
6
fYear
2003
fDate
6/1/2003 12:00:00 AM
Firstpage
1459
Lastpage
1466
Abstract
We model the influence of scattering along the channel and extension regions of dual gate nanotransistors. It is found that the reduction in drain current due to scattering in the right half of the channel is comparable to the reduction in drain current due to scattering in the left half of the channel, when the channel length is comparable to the scattering length. This is in contrast to a popular belief that scattering in the source end of a nanotransistor is significantly more detrimental to the drive current than scattering elsewhere. As the channel length becomes much larger than the scattering length, scattering in the drain-end is less detrimental to the drive current than scattering near the source-end of the channel. Finally, we show that for nanotransistors, the classical picture of modeling the extension regions as simple series resistances is not valid.
Keywords
MOSFET; contact resistance; elemental semiconductors; leakage currents; nanoelectronics; scattering; semiconductor device models; silicon; Si; channel region; drain current reduction; dual gate MOSFET; dual gate nanotransistors; extension regions; leakage currents; modeling; scattering length; scattering role; Contact resistance; Electromagnetic scattering; Electrostatics; Equations; FETs; Lithography; MOSFETs; Particle scattering; Physics; Silicon;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2003.813503
Filename
1213817
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