DocumentCode :
745426
Title :
Optimizing Schottky S/D offset for 25-nm dual-gate CMOS performance
Author :
Connelly, Daniel ; Faulkner, Carl ; Grupp, D.E.
Author_Institution :
Acorn Technol., Palo Alto, CA, USA
Volume :
24
Issue :
6
fYear :
2003
fDate :
6/1/2003 12:00:00 AM
Firstpage :
411
Lastpage :
413
Abstract :
For the first time, mixed mode simulation is used to optimize the design of ultrathin-body dual-gate metal source/drain 25-nm CMOS, showing an advantage for source/drain-to-gate underlap, rather than overlap. The effect of source/drain workfunction and silicon thickness on the optimal underlap, and on the resulting circuit speed, is examined. A substantial performance advantage versus doped source/drain is demonstrated.
Keywords :
CMOS integrated circuits; MOSFET; circuit optimisation; circuit simulation; semiconductor device models; work function; 25 nm; 25-nm dual-gate CMOS performance; NFET parameters; PFET parameters; Schottky S/D offset optimization; circuit speed; mixed mode simulation; performance advantage; semiconductor device modeling; silicon thickness; source/drain work function; source/drain-to-gate underlap; ultrathin-body dual-gate metal source/drain CMOS; Circuit simulation; Design optimization; Doping; MOS devices; Reflection; Schottky barriers; Semiconductor device modeling; Semiconductor process modeling; Silicon on insulator technology; Threshold voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2003.813363
Filename :
1213873
Link To Document :
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