Title :
The effect of prebonding heat treatment on the separability of Au wire from Ag-plated Cu alloy substrate
Author :
Onodera, Masanori ; Suga, Tadatomo
Author_Institution :
Adv. Packaging Technol. R&D Dept., Fujitsu Ltd., Tokyo, Japan
fDate :
1/1/2002 12:00:00 AM
Abstract :
The wire bonding technology that relies on subsequent wire separation of a connection has a possibility of becoming a key packaging technology in the environmentally friendly aspects of the recycling of mounting materials, such as the reworking of chip on board (COB) mounting and the application of the inter-poserless chip size package (CSP) in the manufacturing process. This study investigated how heat treatment before bonding affects separability at the ball bonding area. For the investigation, we used bonding pairs of Ag-plated Cu alloy substrate and An wire. Heating a board to 150°C before wire bonding degraded wire bondability but improved separability. An analysis of Ag plating by Auger electron spectroscopy (AES) and x-ray photoelectron spectroscopy (XPS) revealed that the heat treatment caused the Cu on the board to diffuse into the Ag plating and to deposit concentrations of Cu in the form of Cu(OH)2 and CuCl2 on the Ag surface
Keywords :
Auger electron spectra; X-ray photoelectron spectra; chip scale packaging; chip-on-board packaging; copper alloys; gold; heat treatment; lead bonding; packaging; silver; substrates; 150 degC; AES; Ag; Ag-plated Cu alloy substrate; Au wire separability; Auger electron spectroscopy; COB mounting; Cu(OH)2; CuCl2; X-ray photoelectron spectroscopy; XPS; ball bonding area; chip on board mounting; chip size package; interposerless CSP; packaging technology; prebonding heat treatment; reworking; wire bondability; wire bonding technology; Bonding; Chip scale packaging; Copper alloys; Gold; Heat treatment; Heating; Manufacturing processes; Recycling; Spectroscopy; Wire;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2002.1000477
