• DocumentCode
    745561
  • Title

    A unified compact model of electrical and thermal 3-D spreading resistance between eccentric rectangular and circular contacts

  • Author

    Karmalkar, Shreepad ; Mohan, P. Vishnu ; Kumar, B. Presenna

  • Author_Institution
    Dept. of Electr. Eng., Indian Inst. of Technol., Madras, India
  • Volume
    26
  • Issue
    12
  • fYear
    2005
  • Firstpage
    909
  • Lastpage
    912
  • Abstract
    The spreading resistance between two parallel contacts, the smaller of which is located arbitrarily over the area of the larger, is of wide interest in electrical/thermal design of devices and ICs. We propose a simple, continuous, and asymptotically correct closed-form expression to predict the accurate but involved calculations of this resistance for all contact conditions. The contacts may be rectangular or circular, and the boundary condition on these may either be equipotential/isothermal or uniform current density/uniform heat flux. The validity of the model is established by comparisons with accurate numerical calculations of spreading resistances having aspect ratios in the range zero to 1000 and with experimental observations.
  • Keywords
    Laplace equations; boundary-value problems; contact resistance; current density; electrical contacts; electrical resistivity; integrated circuit modelling; thermal resistance; circular contacts; closed-form modeling; current density; eccentric contact; electrical/thermal design; heat flux; parallel contacts; rectangular contact; spreading resistance; Anodes; Boundary conditions; Cathodes; Contact resistance; Electric resistance; Electrodes; Geometry; Heat sinks; Resistance heating; Thermal resistance; Closed-form modeling; compact modeling; spreading resistance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2005.859627
  • Filename
    1546150