DocumentCode :
745561
Title :
A unified compact model of electrical and thermal 3-D spreading resistance between eccentric rectangular and circular contacts
Author :
Karmalkar, Shreepad ; Mohan, P. Vishnu ; Kumar, B. Presenna
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol., Madras, India
Volume :
26
Issue :
12
fYear :
2005
Firstpage :
909
Lastpage :
912
Abstract :
The spreading resistance between two parallel contacts, the smaller of which is located arbitrarily over the area of the larger, is of wide interest in electrical/thermal design of devices and ICs. We propose a simple, continuous, and asymptotically correct closed-form expression to predict the accurate but involved calculations of this resistance for all contact conditions. The contacts may be rectangular or circular, and the boundary condition on these may either be equipotential/isothermal or uniform current density/uniform heat flux. The validity of the model is established by comparisons with accurate numerical calculations of spreading resistances having aspect ratios in the range zero to 1000 and with experimental observations.
Keywords :
Laplace equations; boundary-value problems; contact resistance; current density; electrical contacts; electrical resistivity; integrated circuit modelling; thermal resistance; circular contacts; closed-form modeling; current density; eccentric contact; electrical/thermal design; heat flux; parallel contacts; rectangular contact; spreading resistance; Anodes; Boundary conditions; Cathodes; Contact resistance; Electric resistance; Electrodes; Geometry; Heat sinks; Resistance heating; Thermal resistance; Closed-form modeling; compact modeling; spreading resistance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2005.859627
Filename :
1546150
Link To Document :
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