DocumentCode
745561
Title
A unified compact model of electrical and thermal 3-D spreading resistance between eccentric rectangular and circular contacts
Author
Karmalkar, Shreepad ; Mohan, P. Vishnu ; Kumar, B. Presenna
Author_Institution
Dept. of Electr. Eng., Indian Inst. of Technol., Madras, India
Volume
26
Issue
12
fYear
2005
Firstpage
909
Lastpage
912
Abstract
The spreading resistance between two parallel contacts, the smaller of which is located arbitrarily over the area of the larger, is of wide interest in electrical/thermal design of devices and ICs. We propose a simple, continuous, and asymptotically correct closed-form expression to predict the accurate but involved calculations of this resistance for all contact conditions. The contacts may be rectangular or circular, and the boundary condition on these may either be equipotential/isothermal or uniform current density/uniform heat flux. The validity of the model is established by comparisons with accurate numerical calculations of spreading resistances having aspect ratios in the range zero to 1000 and with experimental observations.
Keywords
Laplace equations; boundary-value problems; contact resistance; current density; electrical contacts; electrical resistivity; integrated circuit modelling; thermal resistance; circular contacts; closed-form modeling; current density; eccentric contact; electrical/thermal design; heat flux; parallel contacts; rectangular contact; spreading resistance; Anodes; Boundary conditions; Cathodes; Contact resistance; Electric resistance; Electrodes; Geometry; Heat sinks; Resistance heating; Thermal resistance; Closed-form modeling; compact modeling; spreading resistance;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2005.859627
Filename
1546150
Link To Document