• DocumentCode
    745647
  • Title

    A novel approach for generating boundary condition independent compact dynamic thermal networks of packages

  • Author

    Codecasa, Lorenzo

  • Author_Institution
    Dipt. di Elettronica e Inf., Politecnico di Milano, Italy
  • Volume
    28
  • Issue
    4
  • fYear
    2005
  • Firstpage
    593
  • Lastpage
    604
  • Abstract
    A novel approach is proposed for generating compact dynamic thermal models of packages, independent on boundary conditions. This approach is based on the novel definition of Robin´s boundary condition independent dynamic thermal network and on the application of a novel multivariate moment matching method. The resulting compact thermal models are more accurate than compact models obtained by means of previous methods.
  • Keywords
    chip scale packaging; semiconductor device models; semiconductor device packaging; thermal management (packaging); boundary condition; compact thermal models; independent dynamic thermal network; multivariate moment matching method; thermal packages networks; Boundary conditions; Capacitance; Disruption tolerant networking; Equations; Network topology; Packaging; Partitioning algorithms; Thermal resistance; Compact thermal model; multivariate moment matching method;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.859742
  • Filename
    1546162