DocumentCode
745669
Title
High-precision compact-thermal models
Author
Sabry, Mohamed-Nabil
Author_Institution
Univ. Francaise d´´Egypte, Cairo, Egypt
Volume
28
Issue
4
fYear
2005
Firstpage
623
Lastpage
629
Abstract
Classical approaches proposed for the construction of compact-thermal models suffer from a common disadvantage. They provide no means for error control. Although it is evident that the more nodes we define on the surface, the higher will be the precision, there is no guidance as to the required number of nodes to be defined on the surface, as well as the best position and size to obtain a given precision. Intuitive approaches usually used would fail to deal with complex objects such as those having multiple independent heat sources [multichip modules (MCM)]. In this work, based on an original and generalized formulation of the Green´s function, a systematic approach is proposed to build the compact model that gives a better control of these errors, allowing thus the creation of compact models at any desired order of precision. It also gives access to new data concerning tangential gradients on the surface.
Keywords
Green´s function methods; integrated circuit packaging; multichip modules; thermal analysis; thermal management (packaging); Greens function; error control; high-precision compact thermal models; multichip modules; multiple independent heat sources; tangential surface gradients; Boundary conditions; Context modeling; Equations; Error correction; Heat transfer; Multichip modules; Packaging; Performance analysis; Team working; Temperature; Compact-thermal models; precision;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2005.859666
Filename
1546165
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