Title :
Copper thin films on PET prepared at ambient temperature by ECR-CVD
Author :
Ko, Hyungduk ; Jhin, Junggeun ; Byun, DongJin ; Lee, Joongkee ; Park, Dalkeun
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Univ., Seoul, South Korea
Abstract :
Metallized polymers were prepared at ambient temperature by an electron-cyclotron-resonance (ECR) chemical vapor deposition system equipped with (-) DC bias from the Cu (hfac)2-Ar-H2 system. X-ray difraction (XRD) results showed that the Cu (111) peaks were clearly observed when H2 was introduced to the plasma. The surface morphology showed that larger Cu grains were formed in the metal-organic composite films with the introduction of H2 to the plasma. AES depth profiles showed that H2 gas introduction to the plasma led to the formation of copper-rich films with a homogeneous composition. Also, the sheet resistance was strongly dependent on the H2 content of the plasma. This means that hydrogen may lead to both the formation of stable volatile organic compounds and the reduction of copper, which influences both the crystallographic structure and the composition of films. As a result, crystalline copper films with a sheet resistance of 2-3Ω2 can be prepared on poly ethylene terephthalate with the addition of H2 to the plasma.
Keywords :
Auger electron spectra; MOCVD; X-ray diffraction; crystal structure; cyclotron resonance; organometallic compounds; polymer films; sheet materials; surface morphology; thin films; AES depth profile; Cu; Cu grain; ECR-CVD; H2; PET; X-ray difraction; XRD; ambient temperature; chemical vapor deposition; copper thin film; crystalline copper film; crystallographic structure; electron-cyclotron-resonance; metal-organic composite film; metallized polymer; polyethylene terephthalate; sheet resistance; surface morphology; volatile organic compound; Chemical vapor deposition; Copper; Metallization; Plasma chemistry; Plasma stability; Plasma temperature; Polymer films; Positron emission tomography; Transistors; X-ray scattering; Cu(hfac); electron-cyclotron-resonance chemical vapor deposition (ECR-CVD); plasma; poly ethylene terephthalate (PET); sheet resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.859670