Title :
A three-dimensional neural recording microsystem with implantable data compression circuitry
Author :
Olsson, Roy H., III ; Wise, Kensall D.
Author_Institution :
MEMS Device Technol. Group, Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
A 256-site, fully implantable, 3-D neural recording microsystem has been developed. The microsystem incorporates four active neural probes with integrated circuitry for site selection, amplification, and multiplexing. The probes drive an embedded data-compression ASIC that successfully detects neural spikes in the presence of neural and circuit noise. The spike detection ASIC achieves a factor of 12 bandwidth reduction while preserving the key features of the action potential waveshape necessary for spike discrimination. This work extends the total number of neural channels that can be recorded across a transcutaneous inductively coupled wireless link from 25 to 312. When a spike is detected, this ASIC serially shifts the 5-bit amplitude and 5-bit address of the spike off of the chip over a single 2.5 Mb/s wired or wireless line. The spike detection ASIC occupies 6 mm2 in 0.5 μm features and consumes 2.6 mW while the entire microsystem consumes 5.4 mW of power from a 3-V supply.
Keywords :
application specific integrated circuits; bioelectric potentials; biomedical electronics; biosensors; data compression; microsensors; neurophysiology; 0.5 micron; 2.6 mW; 3 V; 3D neural recording microsystem; 5 bit; 5.6 mW; active neural probes; circuit noise; embedded data-compression ASIC; implantable data compression circuitry; neural channels; neural spike detection; spike detection ASIC; transcutaneous inductive coupled wireless link; Application specific integrated circuits; Bioelectric phenomena; Control systems; Data compression; Integrated circuit interconnections; Nervous system; Neural prosthesis; Neurons; Probes; Prosthetics; Amplifiers; bioelectric potentials; biomedical signal detection; biomedical signal processing; data compression; microelectrodes; microsensors; nervous system; time division multiplexing;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2005.858479