DocumentCode :
74659
Title :
Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics
Author :
Musallam, Mahera ; Chunyan Yin ; Bailey, Christopher ; Johnson, Mark
Author_Institution :
Dynex Semicond. Ltd., Lincoln, UK
Volume :
30
Issue :
5
fYear :
2015
fDate :
May-15
Firstpage :
2601
Lastpage :
2613
Abstract :
Power electronics are efficient for conversion and conditioning of the electrical energy through a wide range of applications. Proper life consumption estimation methods applied for power electronics that can operate in real time under in-service mission profile conditions will not only provide an effective assessment of the products life expectancy but they can also deliver reliability design information. This is important to aid in manufacturing and thus helps in reducing costs and maximizing through-life availability. In this paper, a mission profile-based approach for real-time life consumption estimation which can be used for reliability design of power electronics is presented. The paper presents the use of electrothermal models coupled with physics-of-failure analysis by means of real-time counting algorithm to provide accurate life consumption estimations for power modules operating under in-service conditions. These models, when driven by the actual mission profiles, can be utilized to provide advanced warning of failures and thus deliver information that can be useful to meet particular application requirements for reliability at the design stage. To implement this approach, an example of two case studies using mission profiles of a metro-system and wind-turbines applications is presented.
Keywords :
power electronics; semiconductor device manufacture; semiconductor device reliability; electrothermal models; mission profile-based reliability design; physics-of-failure analysis; power electronics; real-time counting algorithm; real-time life consumption estimation; Insulated gate bipolar transistors; Load modeling; Multichip modules; Real-time systems; Reliability; Temperature measurement; Electrothermal models; life consumption; mission profile; physics of failure; power electronics; real time;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2014.2358555
Filename :
6901261
Link To Document :
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