DocumentCode :
746656
Title :
A novel MESFET fabricated by a simple internal interconnection technique
Author :
Dejun, Han ; Chan, K.T. ; GuoHui, Li ; Wenxun, Wang ; Zhu, En-jun
Author_Institution :
Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Volume :
42
Issue :
2
fYear :
1995
fDate :
2/1/1995 12:00:00 AM
Firstpage :
370
Lastpage :
372
Abstract :
A new type of internal interconnection of devices has been developed by implanting a buried horizontal n+ layer and vertical n+ columns inside semi-insulating GaAs. Based on this technique, a novel MESFET with small intrinsic gate-source resistance has been fabricated and tested
Keywords :
III-V semiconductors; Schottky gate field effect transistors; buried layers; gallium arsenide; ion implantation; semiconductor doping; GaAs:Si; MESFET; buried horizontal n+ layer; implantation; internal interconnection technique; intrinsic gate-source resistance; semiinsulating GaAs; vertical n+ columns; Etching; Fabrication; Gallium arsenide; Implants; Integrated circuit interconnections; Integrated circuit technology; MESFETs; Substrates; Testing; Tungsten;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.370051
Filename :
370051
Link To Document :
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