DocumentCode
747230
Title
An improved leaded small outline package and equivalent circuit
Author
Jessie, Darryl ; Larson, Lawrence
Author_Institution
Univ. of California, San Diego, CA, USA
Volume
13
Issue
7
fYear
2003
fDate
7/1/2003 12:00:00 AM
Firstpage
273
Lastpage
275
Abstract
A leaded plastic package has been developed that significantly improves the insertion and return loss, and pin-to-pin isolation of SO-type packages based on measured data and three-dimensional electromagnetic simulations. In addition, an equivalent circuit has been developed that accurately models the circuit behavior of the improved package to above 8 GHz.
Keywords
equivalent circuits; integrated circuit packaging; losses; plastic packaging; radiofrequency integrated circuits; simulation; 10 GHz; 3D electromagnetic simulations; 8 GHz; C-band RFIC applications; SO-type packages; SSOP8 form factor; equivalent circuit; insertion loss; leaded plastic package; leaded small outline package; pin-to-pin isolation; return loss; three-dimensional EM simulations; Circuit simulation; Coplanar waveguides; Electromagnetic modeling; Electromagnetic waveguides; Equivalent circuits; Insertion loss; Microstrip; Pins; Plastic packaging; Radiofrequency integrated circuits;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2003.814596
Filename
1214547
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