DocumentCode :
747334
Title :
Efficient In-Package Decoupling Capacitor Optimization for I/O Power Integrity
Author :
Chen, Jun ; He, Lei
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA
Volume :
26
Issue :
4
fYear :
2007
fDate :
4/1/2007 12:00:00 AM
Firstpage :
734
Lastpage :
738
Abstract :
With high integration density of today´s electronic system and reduced noise margins, maintaining high power integrity becomes more challenging for high performance design. Inserting decoupling capacitors is one important and effective solution to improve the power integrity. The existing decoupling capacitor optimization approaches meet constraints on input impedance. In this paper, we show that impedance metric leads to large overdesign and then develop a noise-driven optimization algorithm for decoupling capacitors in packages for power integrity. We use the simulated annealing algorithm to minimize the total cost of decoupling capacitors under the constraints of a worst case noise bound. The key enabler for efficient optimization is an incremental worst case noise computation based on fast Fourier transform over incremental impedance matrix evaluation. Compared to the existing impedance-based approaches, our algorithm reduces the decoupling capacitor cost by 3times and is also more than 10times faster even with explicit noise computation
Keywords :
capacitors; circuit optimisation; fast Fourier transforms; integrated circuit design; integrated circuit packaging; interference suppression; simulated annealing; design automation; fast Fourier transform; impedance matrix evaluation; impedance metric; inpackage decoupling capacitor optimization; input-output power integrity; noise computation; overdesign; simulated annealing algorithm; simultaneous switching noise; Capacitors; Design optimization; Frequency; Impedance; Integrated circuit noise; Noise reduction; Optimization methods; Packaging; Paramagnetic resonance; Simulated annealing; Decoupling capacitor; design automation; impedance; power integrity; simultaneous switching noise;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2006.888262
Filename :
4135361
Link To Document :
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