Microsensors vs. ICs: a study in contrasts

Author

Senturia, Stephen D.

Author_Institution

Dept. of Electr. Eng., MIT, Cambridge, MA, USA

Volume

6

Issue

6

fYear

1990

Firstpage

20

Lastpage

27

Abstract

Significant differences between microsensors and micromechanisms, on the one hand, and integrated circuits, on the other, are examined from the design viewpoint. Microelectronic sensors, micromachining processes, and micromechanisms and micro-actuators are discussed. The principal technological forces driving microsensor development, namely lithography and planar technology, are considered, and some cautionary advice is given regarding the development of so-called smart sensors. Two issues in regard to the partitioning of measurement systems-device partitioning and calibration-are addressed. Technology constraints and packaging considerations are examined.<>

Keywords

electric actuators; electric sensing devices; integrated circuit technology; lithography; micromechanical devices; packaging; piezoelectric devices; ICs; calibration; device partitioning; integrated circuits; lithography; micromachining processes; micromechanisms; microsensors; packaging; piezoelectric devices; planar technology; smart sensors; Etching; Hall effect; Magnetic sensors; Microactuators; Microelectronics; Micromachining; Microsensors; Silicon; Thermal sensors; Wafer bonding;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/101.100254

Filename

100254