Title :
Microsensors vs. ICs: a study in contrasts
Author :
Senturia, Stephen D.
Author_Institution :
Dept. of Electr. Eng., MIT, Cambridge, MA, USA
Abstract :
Significant differences between microsensors and micromechanisms, on the one hand, and integrated circuits, on the other, are examined from the design viewpoint. Microelectronic sensors, micromachining processes, and micromechanisms and micro-actuators are discussed. The principal technological forces driving microsensor development, namely lithography and planar technology, are considered, and some cautionary advice is given regarding the development of so-called smart sensors. Two issues in regard to the partitioning of measurement systems-device partitioning and calibration-are addressed. Technology constraints and packaging considerations are examined.<>
Keywords :
electric actuators; electric sensing devices; integrated circuit technology; lithography; micromechanical devices; packaging; piezoelectric devices; ICs; calibration; device partitioning; integrated circuits; lithography; micromachining processes; micromechanisms; microsensors; packaging; piezoelectric devices; planar technology; smart sensors; Etching; Hall effect; Magnetic sensors; Microactuators; Microelectronics; Micromachining; Microsensors; Silicon; Thermal sensors; Wafer bonding;
Journal_Title :
Circuits and Devices Magazine, IEEE
