DocumentCode :
747558
Title :
Flow Boiling Heat Transfer to a Dielectric Coolant in a Microchannel Heat Sink
Author :
Chen, Tailian ; Garimella, Suresh V.
Author_Institution :
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN
Volume :
30
Issue :
1
fYear :
2007
fDate :
3/1/2007 12:00:00 AM
Firstpage :
24
Lastpage :
31
Abstract :
This paper presents an experimental study of flow boiling heat transfer in a microchannel heat sink. The dielectric fluid Fluorinert FC-77 is used as the boiling liquid after it is fully degassed. The experiments were performed at three flow rates ranging from 30-50ml/min. The heat transfer coefficients, as well as the critical heat flux (CHF), were found to increase with flow rate. Wall temperature measurements at three locations (near the inlet, near the exit, and in the middle of heat sink) reveal that wall dryout first occurs near the exit of the microchannels. The ratio of heat transfer rate under CHF conditions to the limiting evaporation rate was found to decrease with increasing flow rate, asymptotically approaching unity. Predictions from a number of correlations for nucleate boiling heat transfer in the literature are compared against the experimental results to identify those that provide a good match. The results of this work provide guidelines for the thermal design of microchannel heat sinks in two-phase flow
Keywords :
coolants; dielectric liquids; heat sinks; heat transfer; microchannel flow; temperature measurement; thermal management (packaging); two-phase flow; Fluorinert FC-77; critical heat flux; dielectric coolant; dielectric fluid; flow boiling heat transfer; heat transfer coefficients; limiting evaporation rate; microchannel heat sink; thermal design; two-phase flow; wall temperature measurements; Coolants; Dielectrics; Equations; Heat sinks; Heat transfer; Hydraulic diameter; Microchannel; Thermal conductivity; Thermal management; Water heating; Critical heat flux (CHF); electronics cooling; flow boiling heat transfer; microchannel heat sink;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2007.892063
Filename :
4135383
Link To Document :
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