DocumentCode
747590
Title
The influence of source and drain junction depth on the short-channel effect in MOSFETs
Author
Sleva, Stephen ; Taur, Yuan
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of California, La Jolla, CA, USA
Volume
52
Issue
12
fYear
2005
Firstpage
2814
Lastpage
2816
Abstract
This brief investigates the influence of source and drain junction depth on the short-channel effect (SCE) in highly scaled MOSFETs. The established scale length model represents SCE in terms of an exponential function of gate insulator thickness and gate depletion-layer width, but this model fails to account for any influence of source and drain junction depth on SCE. It is shown using two-dimensional finite-element device simulation that the influence of source and drain junction depth on SCE can be represented by an addition of a pre-exponential term to the established scale-length model. For source and drain junction depths that are deeper than the MOSFET´s gate depletion-layer width, SCE is shown with this pre-exponential term to be insensitive to junction depth. Conversely, for source and drain junction depths that are shallower than the MOSFET´s gate depletion-layer width, SCE is shown to improve linearly with decreasing junction depth.
Keywords
MOSFET; finite element analysis; semiconductor device models; technology CAD (electronics); MOSFET; drain junction depth; finite-element device simulation; gate depletion layer; scale length model; short-channel effect; source junction depth; CMOS technology; Capacitance; Charge carrier density; Doping; Electron devices; Germanium silicon alloys; MOSFET circuits; Potential well; Silicon germanium; Threshold voltage; MOSFET scale length; short-channel effect (SCE); source and drain junction depth;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2005.859614
Filename
1546351
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