Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications

Author

Lim, Michele Hui Fern ; Liang, Zhenxian ; Van Wyk, Jacobus Daniel

Author_Institution

Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA

Volume

30

Issue

1

fYear

2007

fDate

3/1/2007 12:00:00 AM

Firstpage

170

Lastpage

177

Abstract

A novel low profile power inductor suitable for planar integration is designed and fabricated based on low temperature co-fired ceramics technology for microprocessor power delivery applications. The inductor was designed to operate at a switching frequency of 4 to 5MHz, carrying a nominal dc current of 20A with a ripple current of 8 to 10A in a 5-V to 1-V dc-dc converter. The design and fabrication procedure is discussed in this paper, followed by small signal measurement and magnetic characterization results. The inductor was implemented in a prototype converter and the large signal measurement results are presented and its performance evaluated

Keywords

ceramic packaging; power electronics; power inductors; 1 to 5 V; 20 A; 4 to 5 MHz; 8 to 10 A; LTCC technology; low profile integratable inductor; low temperature co-fired ceramics technology; magnetic characterization; microprocessor power delivery applications; planar integration; power electronics; prototype converter; small signal measurement; Ceramics; DC-DC power converters; Fabrication; Inductors; Microprocessors; Prototypes; Signal design; Switching converters; Switching frequency; Temperature; Inductor; low temperature co-fired ceramics (LTCC); power electronics;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2007.892099

Filename

4135399