• DocumentCode
    747731
  • Title

    Corrections to "Enhancing the reliability of wafer level packaging by using solder joints layout design"

  • Author

    Chang-Ming Liu ; Chang-Chun Lee ; Kuo-Ning Chiang

  • Author_Institution
    Adv. Packaging Res. Center, Nat. Tsing Hua Univ., Hsinchu
  • Volume
    30
  • Issue
    1
  • fYear
    2007
  • fDate
    3/1/2007 12:00:00 AM
  • Firstpage
    190
  • Lastpage
    190
  • Abstract
    In the original paper (see ibid., vol.29, no.4, p.877-85, Dec. 2006) the photographs of authors Chang-Ming Liu and Chang-Chun Lee were inadvertently switched in the biography section. The correct placement is shown here.
  • Keywords
    reliability; soldering; wafer level packaging; reliability; solder joints layout design; wafer level packaging; Biographies; Electronics packaging; Laboratories; Mechanical engineering; Micromechanical devices; Paper technology; Power engineering computing; Soldering; Solids; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2006.890539
  • Filename
    4135400