• DocumentCode
    747756
  • Title

    On The Problem of Using Guard Traces for High Frequency Differential Lines Crosstalk Reduction

  • Author

    Mbairi, Felix D. ; Siebert, W.P. ; Hesselbom, Hjalmar

  • Author_Institution
    Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol., Stockholm
  • Volume
    30
  • Issue
    1
  • fYear
    2007
  • fDate
    3/1/2007 12:00:00 AM
  • Firstpage
    67
  • Lastpage
    74
  • Abstract
    In this paper, the problem of using guard traces for reducing crosstalk between differential transmission line pairs is investigated, both experimentally and by full-wave electromagnetic (EM) simulations. Different cases of differential lines crosstalk are treated with and without guard trace separation between the differential line pairs. Coated microstrip printed circuit board test structures including thru-reflect-line calibration standards are designed and fabricated on a high frequency laminate material, allowing direct measurement of crosstalk between adjacent differential line pairs in the absence and in the presence of guard traces stitched with vias of regular spacing. The test structures are characterized with mixed-mode scattering parameters using a physical layer test system. Different configurations (of differential line pairs) without guard trace, with floating guard traces (which are terminated and nonterminated) and with a solid guard trace separation are investigated using a High Frequency Structure Simulator (a commercial full-wave 3-D EM simulation tool). The experimental data are compared with the simulation results, and some conclusions and guidelines on the effect of guard traces for alleviating crosstalk between differential transmission lines are presented
  • Keywords
    S-parameters; crosstalk; high-frequency transmission lines; laminates; microstrip lines; printed circuit testing; crosstalk reduction; differential transmission line pairs; full-wave 3D EM simulation tool; full-wave electromagnetic simulations; guard traces; high frequency differential lines; high frequency laminate material; high frequency structure simulator; microstrip printed circuit board test structures; mixed-mode scattering parameters; physical layer test system; solid guard trace separation; thru-reflect-line calibration standards; Circuit simulation; Circuit testing; Crosstalk; Distributed parameter circuits; Frequency; Materials testing; Microstrip; Printed circuits; Solid modeling; System testing; $S$-parameters measurement; Coated microstrip differential transmission lines; coupling; guard trace; high frequency crosstalk; signal integrity; thru-reflect-line (TRL) calibration;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2007.892072
  • Filename
    4135402