DocumentCode
747821
Title
Miniature Loop Heat Pipe With Flat Evaporator for Cooling Computer CPU
Author
Singh, Randeep ; Akbarzadeh, Aliakbar ; Dixon, Chris ; Mochizuki, Mastaka ; Riehl, Roger R.
Author_Institution
Sch. of Aerosp., R. Melbourne Inst. of Technol., Vic.
Volume
30
Issue
1
fYear
2007
fDate
3/1/2007 12:00:00 AM
Firstpage
42
Lastpage
49
Abstract
This paper presents an experimental investigation on a copper miniature loop heat pipe (mLHP) with a flat disk shaped evaporator, 30mm in diameter and 10-mm thick, designed for thermal control of computer microprocessors. Tests were conducted with water as the heat transfer fluid. The device was capable of transferring a heat load of 70W through a distance up to 150mm using 2-mm diameter transport lines. For a range of power applied to the evaporator, the system demonstrated very reliable startup and was able to achieve steady state without any symptoms of wick dry-out. Unlike cylindrical evaporators, flat evaporators are easy to attach to the heat source without need of any cylinder-to-plane reducer material at the interface and thus offer very low thermal resistance to the heat acquisition process. In the horizontal configuration, under air cooling, the minimum value for the mLHP thermal resistance is 0.17degC/W with the corresponding evaporator thermal resistance of 0.06degC/W. It is concluded from the outcomes of the current study that a mLHP with flat evaporator geometry can be effectively used for the thermal control of electronic equipment including notebooks with limited space and high heat flux chipsets. The results also confirm the superior heat transfer characteristics of the copper-water configuration in mLHPs
Keywords
cooling; copper; heat pipes; microprocessor chips; temperature control; thermal management (packaging); thermal resistance; 10 mm; 30 mm; 70 W; Cu; air cooling; computer CPU cooling; computer microprocessors; copper miniature loop heat pipe; copper-water configuration; electronic equipment; evaporator thermal resistance; flat disk shaped evaporator; heat acquisition process; heat flux chipsets; heat transfer characteristics; heat transfer fluid; thermal control; Cooling; Copper; Heat transfer; Power system reliability; Resistance heating; Shape control; Space heating; Temperature control; Thermal resistance; Water heating; CPU cooling; flat evaporator; miniature loop heat pipe (mLHP); thermal control;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.892066
Filename
4135408
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